Ingo orientation process.
Tool for scribing ingot face after orientation is performed.
Holder for wafer flat / face orienta-tion measurement
PERFORMANCE
Accuracy of goniometric measurements : +/- 0,01°
Ingot orientation accuracy : +/- 0,05° (+/- 3')
Goniometer rotation range : - 8 to 100°
Specific devices
Dedicated tools allows ingot flat or notch to be placed at a reference position (initial datum)
The same device is used for scribing ingot face after the orientation is performed.
Software
User friendly operator interface provides easy and safe operation.
Zero reset of relative measurement display with respect to the crystal planes (manual mode).
Zero reset of ingot rotation display
Automatic recalibration at start up
X-Ray generator
Out put voltage : 30 kV-DC Max. rating : 30mA
RANGE OF APPLICATION
Ingot orientation prior to wire saw cutting
Ingot axis orientation measurement
Determination of (110) directions on (111) ingots.
Orientation measurement of wafer face
GONIOMETER FEATURES
Acceptable load : 100kg
Ingot diam. : 100-300mm
length up to 450mm
Fine rotation control on whole rotation range
High resolution incremental encoder without any blacklash.
Ingot holding : 2 heavy duty rubber coated rolls.
Double diffraction option
The GM WS Series X-ray orientation units are specifically dedicated to the accurate orientation of large size ingots before cutting on a wire saw.
By using this equipment, the ingot orientation is measured in such a way that the ingot can remain horizontal on the wire saw work holder for further slicing process, taking both the ingot self-disorientation and the ''off orientation'' required by the customer.
GM WS Series
X-Ray Goniometer
INGOT ORIENTATION FOR WIRE SAW CUTTING
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